Ti-Rich Barrier Layers Self-Formed on Porous Low-k Layers Using Cu(1 at.% Ti) Alloy Films

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ژورنال

عنوان ژورنال: Journal of Electronic Materials

سال: 2010

ISSN: 0361-5235,1543-186X

DOI: 10.1007/s11664-010-1182-8